Peridynamic wetness approach for moisture concentration analysis in electronic packages
نویسندگان
چکیده
منابع مشابه
Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions
Article history: Received 23 November 2016 Received in revised form 3 March 2017 Accepted 12 April 2017 Available online 19 April 2017 The normalization approach has been accepted as a routine to overcome the concentration discontinuity at multi-material interfaces in the moisture diffusion simulation by the finite element method. However, applying the normalization approach directly in the com...
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ژورنال
عنوان ژورنال: Microelectronics Reliability
سال: 2017
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2017.01.008